Centro de Envases y Embalajes de Chile - CENEM,
is pleased to invite you to EXPO LatinPack CHILE 2018, to be hosted on June 7 and 8 at Espacio Riesco, Santiago.
LatinPack CHILE 2018 will be the meeting point for the packaging industry and its value chain to exchange knowledge, introduce new technologies and researches, new materials and supplies, services, clean energy, waste management, networking and the commercial exchange between the industry players.
Show to the audience, authorities, entrepreneurs and civil society the benefits of a competitive industry, of high technology and professionalism prepared to face the challenges of the country program
“Chile empowers healthy food”.
As a complement, talks and workshops will be held on this Fair, based on “the Packaging of the Future”.
Sustainability is the main strategic aim in the packaging Industry. Moreover, great opportunities and challenges are being opened now due to the new promoted Recycling Law and its future regulations.
The industry must incorporate technologies and environmental management in the processes that guarantee sustainability on its productive line.
The lack of skilled labor and high turnover in young executives open up new business challenges speeding up the process of automation, control, traceability, where certifications and requirements are every day higher for international markets and more informed consumers.
Today, we are going towards an industry 4.0 and the packaging Industry and its value chain will be showing the latest aspects of this matter in this fair.
SUSTAINABILITY, HUMAN CAPITAL INNOVATION, DIGITAL PACKAGING.
TOWARDS AN INDUSTRY 4.0
YOUR COMPANY CANNOT MISS THIS OPPORTUNITY TO BE PART OF THIS BIGGEST MEETING OF PACKAGING
Successful opening of
EXPO LATINPACK CHILE 2018
EXPO LatinPack CHILE 2018 - +569 61322289 - email@example.com